Application of copper-Carbon Nanotubes composite in packaging interconnects

Author

Aryasomayajula, Lavanya ; Rieske, Ralf ; Wolter, Klaus Juergen

Author_Institution

Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany

fYear

2011

fDate

11-15 May 2011

Firstpage

531

Lastpage

536

Abstract

This paper concentrates on the work done on utilizing Carbon Nanotubes (CNTs) for Electronic Packaging. CNTs have been utilized in various aspects of Electronic Packaging, for instance in solder joints, as filler materials for copper-CNT composites and CNTs themselves to replace copper for future interconnect technology. This paper also discusses the fabrication of copper-CNT composite.

Keywords

carbon nanotubes; copper; electronics packaging; interconnections; solders; Cu-C; copper-CNT composites; copper-carbon nanotubes composite; electronic packaging; filler materials; packaging interconnects; solder joints; Carbon nanotubes; Conductivity; Copper; Electronics packaging; Materials; Mechanical factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2011 34th International Spring Seminar on

Conference_Location

Tratanska Lomnica

ISSN

2161-2528

Print_ISBN

978-1-4577-2111-3

Type

conf

DOI

10.1109/ISSE.2011.6053943

Filename

6053943

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1961811