Quality control of ultrasonic bonding tools using a Scanning White Light Interferometer

Author

Heikkinen, Ville ; Kurppa, Risto ; Seppänen, Henri ; Räikkönen, Heikki ; Aaltonen, Juha ; Kassamakov, Ivan ; Haeggstrom, Edward

Author_Institution

Dept. of Phys., Univ. of Helsinki, Helsinki, Finland

fYear

2010

fDate

11-14 Oct. 2010

Firstpage

1428

Lastpage

1430

Abstract

Working surface of the ultrasonic bonding wedge must adhere to tight specifications to permit strong and repeatable ultrasonic wire bonding. Even minute changes in the wedge surface reduce the yield, especially when bonding to fragile materials. Consequently the ability to determine the profile of the bonding surface of the wedge could contribute to improved yield. We propose to use Scanning White Light Interferometry (SWLI) to measure the working surface topology of these wedges. SWLI measures complex surfaces with nanometer height resolution.

Keywords

lead bonding; light interferometry; quality control; ultrasonic bonding; SWLI; nanometer height resolution; quality control; scanning white light interferometer; ultrasonic bonding tools; ultrasonic bonding wedge; ultrasonic wire bonding; Acoustics; Bonding; Optical interferometry; Optical variables measurement; Surface topography; Ultrasonic variables measurement; Wires; Scanning White Light Interferometry; microelectronics manufacturing; quality control; ultrasonic bonding; wire bonding wedge;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium (IUS), 2010 IEEE

Conference_Location

San Diego, CA

ISSN

1948-5719

Print_ISBN

978-1-4577-0382-9

Type

conf

DOI

10.1109/ULTSYM.2010.5935926

Filename

5935926