Title :
Quality control of ultrasonic bonding tools using a Scanning White Light Interferometer
Author :
Heikkinen, Ville ; Kurppa, Risto ; Seppänen, Henri ; Räikkönen, Heikki ; Aaltonen, Juha ; Kassamakov, Ivan ; Haeggstrom, Edward
Author_Institution :
Dept. of Phys., Univ. of Helsinki, Helsinki, Finland
Abstract :
Working surface of the ultrasonic bonding wedge must adhere to tight specifications to permit strong and repeatable ultrasonic wire bonding. Even minute changes in the wedge surface reduce the yield, especially when bonding to fragile materials. Consequently the ability to determine the profile of the bonding surface of the wedge could contribute to improved yield. We propose to use Scanning White Light Interferometry (SWLI) to measure the working surface topology of these wedges. SWLI measures complex surfaces with nanometer height resolution.
Keywords :
lead bonding; light interferometry; quality control; ultrasonic bonding; SWLI; nanometer height resolution; quality control; scanning white light interferometer; ultrasonic bonding tools; ultrasonic bonding wedge; ultrasonic wire bonding; Acoustics; Bonding; Optical interferometry; Optical variables measurement; Surface topography; Ultrasonic variables measurement; Wires; Scanning White Light Interferometry; microelectronics manufacturing; quality control; ultrasonic bonding; wire bonding wedge;
Conference_Titel :
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4577-0382-9
DOI :
10.1109/ULTSYM.2010.5935926
