Application for WLP at positive working photosensitive polybenzoxazole

Author

Hirano, Takashi ; Yamamoto, Kagehisa ; Imamura, Ken

Author_Institution

Electron. Device Mater. Res. Lab., Sumitomo Bakelite Co. Ltd., Tochigi, Japan

fYear

2003

fDate

30 June-2 July 2003

Firstpage

246

Lastpage

249

Abstract

A positive working photosensitive polybenzoxazole (PBO) for use as a semiconductor surface coating material has been developed. This material has been widely used as a buffer coating to protect electrical circuitry on IC chips in the semiconductor market. We have now developed a new positive working photosensitive PBO for Wafer Level Packaging (WLP). These cured PBO films have very low water absorption and low dielectric constant in addition to high adhesion to a wide range of substrates including SiO2, etc. Additionally, the patterned profile of the developed and cured film has the desired taper shape, which makes these materials suitable as the interlayer dielectric film for WLP.

Keywords

adhesion; dielectric materials; dielectric thin films; packaging; permittivity; polymers; IC chips; adhesion; buffer coating; dielectric constant; dielectric film; electrical circuitry; low water absorption; photosensitive polybenzoxazole; semiconductor surface coating; wafer level packaging; Absorption; Adhesives; Circuits; Coatings; Dielectric constant; Dielectric materials; Protection; Semiconductor films; Semiconductor materials; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial

ISSN

0749-6877

Print_ISBN

0-7803-7972-1

Type

conf

DOI

10.1109/UGIM.2003.1225736

Filename

1225736