New high reliability IC bonding film and its development

Author

Ganatra, C.P. ; Ohashi, Kazuhiko ; Tabuchi, Yumi ; Yokomizo, Osamu ; Nakamura, Shozo

Author_Institution

W.L. Gore & Assoc. Inc, Elkton, MD, USA

fYear

2003

fDate

30 June-2 July 2003

Firstpage

258

Lastpage

262

Abstract

The die-attach adhesive used in CSP (Chip Size Package) is a crucial component that determines the reliability of CSP. This paper will describe a die-attach adhesive film with high reliability that has been developed using ePTFE (expanded polytetrafluoroethylene). Two structures have been made: tri-layered and mono-layered adhesive films and their characteristics and differences are studied. Also, thermal residual stress and warp deformation behavior of BOC (Board On Chip) and the μBGA^® package are analyzed with a viscoelasticity simulation. It is determined from this simulation that a BOC package using thin mono-layered adhesive film has nearly the same reliability as μBGA^®.

Keywords

adhesive bonding; chip scale packaging; deformation; integrated circuit bonding; integrated circuit reliability; internal stresses; microassembling; polymers; thermal stresses; thin films; viscoelasticity; CSP; PTFE; board on chip; chip size package; die-attach adhesive; monolayered adhesive films; polytetrafluoroethylene; reliability IC bonding film; thermal residual stress; trilayered adhesive films; viscoelasticity; warp deformation; Bonding; Chip scale packaging; Elasticity; Electronic packaging thermal management; Epoxy resins; Resistance heating; Scanning electron microscopy; Temperature; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial

ISSN

0749-6877

Print_ISBN

0-7803-7972-1

Type

conf

DOI

10.1109/UGIM.2003.1225738

Filename

1225738