• DocumentCode
    1962729
  • Title

    Fabrication of a silicon micro-scalpel with a nanometer cutting edge

  • Author

    Neudeck, Gerold W. ; Denton, John P. ; Stidham, Mark E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2003
  • fDate
    30 June-2 July 2003
  • Firstpage
    304
  • Lastpage
    307
  • Abstract
    A silicon micro-scalpel with a nanometer cutting edge bas been fabricated. The fabrication process involves only one mask, and uses RIE, DRIE, and SEG processes. The resulting scalpel is an order of magnitude smaller than any micro-scalpels currently in production. It offers benefits of reduced cost, reduced surface roughness, sharper cutting edges, and blade facets for reduction of tissue or cell tearing. Other structures, such as a micro-probe with a nanometer cutting tip, have also been fabricated using the same process.
  • Keywords
    cutting tools; elemental semiconductors; epitaxial growth; masks; micromechanical devices; nanotechnology; silicon; sputter etching; surface roughness; blade facets; cell tearing; deep reactive ion etching; microprobes; nanometer cutting edge; reactive ion etching; selective epitaxial growth; sharper cutting edges; silicon microscalpel fabrication; surface roughness; tissue; Blades; Epitaxial growth; Etching; Fabrication; Lithography; Production; Resists; Rough surfaces; Silicon; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-7972-1
  • Type

    conf

  • DOI
    10.1109/UGIM.2003.1225749
  • Filename
    1225749