Title :
Effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages
Author :
Sheen, M.T. ; Chang, C.B. ; Teng, H.C. ; Kuang, J.H. ; Hsieh, K.C. ; Cheng, W.H.
Author_Institution :
Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
The effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages has been studies experimentally and numerically. Samples were aged at 150°C for one, four, nine, sixteen, twenty-five, and thirty-six days. It was found that the joint strength decreased as the aging tune increased. This joint strength decreased may be due to the brittle fractures associated with void formation increased in solder joints. A finite-element method (FEM) simulation of joint strength was in reasonable agreement with the experimental measurements
Keywords :
ageing; brittle fracture; finite element analysis; internal stresses; semiconductor device packaging; semiconductor lasers; soldering; thermal management (packaging); thermal stresses; voids (solid); 1 to 36 day; 150 C; AuSn; FEM simulation; PbSn; aging tune; brittle fractures; coupled thermal-elasticity-plasticity model; eutectic solders; laser assembly; laser diode chip; laser packages; laser-solder-submount assembly; relative void percentage; residual stress; shear stress; solder joint strength effect; solderability; solidification; thermal aging; void formation; Aging; Assembly; Diode lasers; Finite element methods; Gold; Laser theory; Lasers and electrooptics; Packaging; Soldering; Testing;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.968859
