DocumentCode
1962976
Title
Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Author
Elger, Gordon ; Voigt, Jan ; Opperman, Hermann
Author_Institution
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Volume
2
fYear
2001
fDate
2001
Firstpage
437
Abstract
The AuSn solder process is applied to optoelectronic modules using a high accuracy flip-chip bonder (Karl Suss FC150). The different requirements of the modules are matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters, i.e. temperature, bond-force and hold-time
Keywords
flip-chip devices; gold alloys; integrated circuit metallisation; integrated optoelectronics; modules; optical fabrication; optical transmitters; soldering; tin alloys; AuSn; AuSn solder processes; after bonding accuracy; bond pads; bond-force; bonding parameters; flip-chip-bonding; high accuracy flip-chip bonder; hold-time; metallization layers; optoelectronic modules; solder deposition; temperature; Assembly; Bonding; Gold; Intermetallic; Lenses; Mechanical factors; Metallization; Optical devices; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location
San Diego, CA
ISSN
1092-8081
Print_ISBN
0-7803-7105-4
Type
conf
DOI
10.1109/LEOS.2001.968860
Filename
968860
Link To Document