DocumentCode :
1963195
Title :
Characterization of reversed c-axis AlN thin films
Author :
Larson, John D., III ; Mishin, Sergey ; Bader, Stefan
Author_Institution :
Wireless Semicond. R&D, Avago Technol., San Jose, CA, USA
fYear :
2010
fDate :
11-14 Oct. 2010
Firstpage :
1054
Lastpage :
1059
Abstract :
Background: It is desired to grow AlN in a reversed c-axis configuration to fabricate R-FBARS (Reversed c-axis Film Bulk Acoustic Resonator) with reactively sputtered, thin film Aluminum Nitride (AlN). Previous methods of growing reversed c-axis AlN, result in films with low electro-acoustic coupling constant, low Q, or inability to withstand the Avago Technologies FBAR release process. Conribution/Methods: An AMS Inc. deposition tool, modified to allow independent control and unique processes, was used to deposit AlN on Al, Mo or W bottom electrodes used in this study. AlN films of thickness 1.2 microns were deposited over patterned bottom electrodes, with additional processing used to reverse the c-axis of the A1N. A top electrode was deposited, patterned, and either processing stopped at the transducer point, or the R-FBAR was released from the silicon wafer with HF acid. Results: The Avago Technologies Acoustic Imaging Microscope interferometer (AIM) is used in point mode to determine the AlN c-axis orientation. The transducer or R-FBAR is driven with a 40 kHz sine wave, and the phase of the top surface motion is observed. Both the orientation and the piezoelectric coefficient were determined. To evaluate the material constants of the AlN for the R-FBAR structure, the input RF reflection coefficient vs frequency is measured. From a one dimensional Mason model for the R-FBAR stack, the AlN material parameters - coupling constant kt2, resonant frequency, velocity, and attenuation, were determined by varying them in the model, to backfit the measured data. R-FBAR resonators with reversed c-axis orientation, termed type CN ("Compression Negative"), as well as FBARS with normal c-axis orientation termed Type CP, ("Compression Positive"), were fabricated. A strong piezocoupling constant was observed, depending on the deposition parameters used. The voltage shift ("Voltco") coefficient of the resonator resonant frequencies, fs or f- - r, was observed, compared to the interoferometric observations, and found to be a reliable indicator of c-axis polarity. For the FBARS and R-FBARS reported here, for the Type CP films, a Voltco of +40 kHz/Volt was observed, and for Type CN films, -30 kHz/Volt was observed. Low frequency REARS and high frequency RSBARS stacked resonator structures were fabricated, and preliminary results are given.
Keywords :
III-V semiconductors; acoustic microscopy; acoustic resonators; acoustic wave interferometry; acoustoelectric effects; dielectric resonators; permittivity; piezoelectric semiconductors; piezoelectric thin films; piezoelectric transducers; piezoelectricity; semiconductor growth; semiconductor thin films; sputter deposition; wide band gap semiconductors; Al; AlN; Avago technologies acoustic imaging microscope interferometer; HF acid; Mo; R-FBAR structure; W; attenuation; compression negative type; compression positive type; deposition parameters; electroacoustic coupling constant; frequency 40 kHz; input RF reflection coefficient; input RF reflection frequency; interoferometric observations; one- dimensional Mason model; patterned bottom electrodes; piezoelectric coefficient; resonant frequency; reversed c-axis thin film bulk acoustic resonator; silicon wafer; sine wave; size 1.2 micron; sputter deposition; surface motion; transducer point; voltage shift coefficient; Aluminum; Couplings; Electrodes; Film bulk acoustic resonators; Films; Frequency measurement; Resonant frequency; AlN; Thin film; piezoelectricity; reversed c-axis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location :
San Diego, CA
ISSN :
1948-5719
Print_ISBN :
978-1-4577-0382-9
Type :
conf
DOI :
10.1109/ULTSYM.2010.5935971
Filename :
5935971
Link To Document :
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