DocumentCode
1964080
Title
Open architecture test system: the new frontier
Author
Pérez, Sergio M. ; Furukawa, Yasuo
Author_Institution
Advantest America, Santa Clara, CA, USA
fYear
2003
fDate
16-18 July 2003
Firstpage
211
Lastpage
214
Abstract
The recent test challenges have resulted ina general consensus that the test industry needs a fundamental change. The increasing complexity of the present day System-on-a-Chip (SOC) devices and simultaneous demand in the test cost reduction has forced both IC manufactures (ATE End Users) and tester vendors (ATE Suppliers) to re-think how IC testing should be done. According to the 2001 ITRS roadmap, without re-engineering, the projected tester cost will continue to increase in the near future; such increasing cost alone requires a fundamental change. A common, open architecture test system platform has been envisioned to address this challenge. The open architecture allows third parties to develop test solutions in the most efficient environment and promotes the reusability of hardware and software modules. Thus, it reduces the development time (time to market) and the overall testing cost. This paper discusses the basic concept of the Semiconductor Test Consortium open architecture (OPEN STARTM) together with the benefits to the industry and the program to implement this industry wide effort.
Keywords
cost reduction; integrated circuit manufacture; integrated circuit testing; system-on-chip; time to market; IC manufactures; IC testing; ITRS roadmap; hardware modules; open architecture test system; overall testing cost; semiconductor test consortium open architecture; software modules; system-on-chip devices; test cost reduction; time to market; Computer architecture; Costs; Hardware; Integrated circuit testing; Manufacturing industries; Software reusability; Software testing; System testing; System-on-a-chip; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN
1089-8190
Print_ISBN
0-7803-7933-0
Type
conf
DOI
10.1109/IEMT.2003.1225902
Filename
1225902
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