Title :
Smart integrated temperature sensor - mixed-signal circuits and systems in 32-nm and beyond
Author :
Li, Y. William ; Lakdawala, Hasnain
Author_Institution :
Adv. Design & Intel Lab., Intel Corp., USA
Abstract :
Integrating smart temperature sensors into digital platforms facilitates information to be processed and transmitted, and open up new applications. Furthermore, temperature sensors are crucial components in computing platforms to manage power-efficiency trade-offs reliably under a thermal budget. This paper presents a holistic perspective about smart temperature sensor design from system- to device-level including manufacturing concerns. Through smart sensor design evolutions, we identify some scaling paths and circuit techniques to surmount analog/mixed-signal design challenges in 32-nm and beyond. We close with opportunities to design smarter temperature sensors.
Keywords :
intelligent sensors; mixed analogue-digital integrated circuits; temperature sensors; analog-mixed-signal design; digital platform; holistic perspective; mixed-signal circuits; power-efficiency trade-offs; size 32 nm; smart integrated temperature sensor design; thermal budget; Accuracy; Calibration; Intelligent sensors; Temperature; Temperature measurement; Temperature sensors;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4577-0222-8
DOI :
10.1109/CICC.2011.6055295