Extreme high speed microvia drilling of chip and wafer scale packaging products

The research and development of the optical system described was due in part to the virtual stalemate of current microvia drilling technology within the high density interconnect marketplace. The desire by industry to acquire faster processes for drilling microvias led to our research in the utilization of hybrid optical systems, where standard refractive and computer generated diffractive optics could be meshed to create a system that would out perform the current technology in the marketplace today. The outcome of this work is covered in the following paper and will at the outset briefly cover the architecture and the technology behind the laser optical beam delivery system and the unique components that make up the assembly. The laser beam characteristics at several points along the beam delivery will be discussed as well as the final image formed at the target plane, where the microvias are drilled and the importance of proper shape on target. Specific performance details will be shared with regards to total system performance. The final section will cover materials processing including the general process rate increases and microvia hole quality achieved.