• DocumentCode
    1964649
  • Title

    2D or 3D? benefits of combining both in a single X-ray system

  • Author

    Frank, Udo E.

  • Author_Institution
    Feinfocus USA Inc., Stamford, CT, USA
  • fYear
    2003
  • fDate
    16-18 July 2003
  • Firstpage
    389
  • Lastpage
    393
  • Abstract
    Optimum flexibility in X-ray inspection is achieved by combining 2D real-time imaging with 3D Axial Computed Tomography (ACT) in a single system. Switching from one mode to the other takes only a keystroke; and the selection can be made anytime - and as often as required - during the inspection process. The role played by X-ray systems in the inspection of electronic assemblies - especially today\´s printed circuit boards, densely packed with area array components - is well understood. Unlike machine vision and optical inspection equipment, X-ray systems penetrate materials to expose hidden solder joints on area array devices, such as flip chips and BGAs. Once a need for X-ray inspection equipment has been determined, the next question is "which is best for the application, two dimensional (2D) or three dimensional (3D)?".
  • Keywords
    X-ray imaging; assembling; computerised tomography; flip-chip devices; inspection; printed circuits; real-time systems; 2D real time imaging; 3D axial computed tomography; X-ray inspection; array devices; electronic assemblies; flip chips; hidden solder joints; inspection process; optimum flexibility; printed circuit boards; single X-ray system; Assembly systems; Computed tomography; Inspection; Machine vision; Optical arrays; Optical devices; Optical imaging; Printed circuits; Real time systems; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-7933-0
  • Type

    conf

  • DOI
    10.1109/IEMT.2003.1225933
  • Filename
    1225933