DocumentCode
1964649
Title
2D or 3D? benefits of combining both in a single X-ray system
Author
Frank, Udo E.
Author_Institution
Feinfocus USA Inc., Stamford, CT, USA
fYear
2003
fDate
16-18 July 2003
Firstpage
389
Lastpage
393
Abstract
Optimum flexibility in X-ray inspection is achieved by combining 2D real-time imaging with 3D Axial Computed Tomography (ACT) in a single system. Switching from one mode to the other takes only a keystroke; and the selection can be made anytime - and as often as required - during the inspection process. The role played by X-ray systems in the inspection of electronic assemblies - especially today\´s printed circuit boards, densely packed with area array components - is well understood. Unlike machine vision and optical inspection equipment, X-ray systems penetrate materials to expose hidden solder joints on area array devices, such as flip chips and BGAs. Once a need for X-ray inspection equipment has been determined, the next question is "which is best for the application, two dimensional (2D) or three dimensional (3D)?".
Keywords
X-ray imaging; assembling; computerised tomography; flip-chip devices; inspection; printed circuits; real-time systems; 2D real time imaging; 3D axial computed tomography; X-ray inspection; array devices; electronic assemblies; flip chips; hidden solder joints; inspection process; optimum flexibility; printed circuit boards; single X-ray system; Assembly systems; Computed tomography; Inspection; Machine vision; Optical arrays; Optical devices; Optical imaging; Printed circuits; Real time systems; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN
1089-8190
Print_ISBN
0-7803-7933-0
Type
conf
DOI
10.1109/IEMT.2003.1225933
Filename
1225933
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