DocumentCode :
1964685
Title :
Epoxy flux - an answer for reliable no-clean flip chip assembly
Author :
Yin, Wusheng ; Beckwith, Geoffrey ; Hwang, Hong-Sik ; Kresge, Lee ; Lee, Ning-Cheng
Author_Institution :
Indium Corp. of America, Clinton, NY, USA
fYear :
2003
fDate :
16-18 July 2003
Firstpage :
409
Lastpage :
415
Abstract :
A novel epoxy flux PK-001 is developed and tested for no-clean flip chip attachment processes with tin-lead eutectic solder bumps. Results indicate that soldering and flux residue curing can be accomplished with a single reflow process. PK-001 provides adequate solder wetting and excellent non-voiding behavior for flip chip applications. The latter is attributable to its low volatility at above solder melting temperature. The uniformity of joint coverage area enables a tight soldering quality control. This is particularly crucial for high I/O count flip chip applications. The thermoset flux residue nature allows good compatibility with underfills, particularly under high temperature and high humidity conditions. Low ionics content, low corrosivity, and high SIR performance provide the essential remaining properties required for no-clean applications.
Keywords :
flip-chip devices; lead alloys; melting; microassembling; quality control; reflow soldering; tin alloys; wetting; I/O count flip chip application; SnPb; corrosivity; epoxy flux; flip chip applications; flip chip assembly; flip chip attachment processes; humidity conditions; low ionics content; reflow process; solder melting temperature; solder wetting; soldering quality control; thermoset flux residue; tin lead eutectic solder bumps; Assembly; Atmosphere; Blades; Cameras; Costs; Flip chip; Nitrogen; Soldering; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN :
1089-8190
Print_ISBN :
0-7803-7933-0
Type :
conf
DOI :
10.1109/IEMT.2003.1225936
Filename :
1225936
Link To Document :
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