DocumentCode
1964780
Title
Investigation of solder ball attachment processes
Author
Geiger, David A. ; Shangguan, Dongkai ; Rooney, Dan
Author_Institution
Flextronics, San Jose, CA, USA
fYear
2003
fDate
16-18 July 2003
Firstpage
443
Lastpage
444
Abstract
There is a great deal of interest in methods to attach solder balls to substrates for various applications. In this work, different ball attachment methods are evaluated. In particular, two methods are evaluated in detail, including the paste printing and reflow method, and the ball placement method. Different solder alloys are included in the study. Solder ball dimensional accuracy, shear strength, and voiding are also characterized.
Keywords
printed circuit manufacture; reflow soldering; shear strength; solders; surface mount technology; ball placement method; dimensional accuracy; paste printing; reflow method; shear strength; solder alloys; solder ball attachment; substrates; voiding; Apertures; Assembly systems; Costs; Medical services; Packaging; Printed circuits; Printing; Surface-mount technology; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN
1089-8190
Print_ISBN
0-7803-7933-0
Type
conf
DOI
10.1109/IEMT.2003.1225942
Filename
1225942
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