• DocumentCode
    1965442
  • Title

    CDM-ESD induced damage in components using stacked-die packaging

  • Author

    Olson, Nicholas ; Jack, Nathan ; Shukla, Vrashank ; Rosenbaum, Elyse

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2011
  • fDate
    19-21 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.
  • Keywords
    electronics packaging; electrostatic discharge; CDM ESD; die stacking; induced damage; inter die signal interfaces; peak discharge current; protection clamp; stacked die packaging; Clamps; Electrostatic discharge; Integrated circuit reliability; Logic gates; Receivers; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2011 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4577-0222-8
  • Type

    conf

  • DOI
    10.1109/CICC.2011.6055359
  • Filename
    6055359
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1965442