Title :
CDM-ESD induced damage in components using stacked-die packaging
Author :
Olson, Nicholas ; Jack, Nathan ; Shukla, Vrashank ; Rosenbaum, Elyse
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.
Keywords :
electronics packaging; electrostatic discharge; CDM ESD; die stacking; induced damage; inter die signal interfaces; peak discharge current; protection clamp; stacked die packaging; Clamps; Electrostatic discharge; Integrated circuit reliability; Logic gates; Receivers; Stress;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4577-0222-8
DOI :
10.1109/CICC.2011.6055359
