DocumentCode :
1965571
Title :
Measure the Thickness of the Thin-Film Single-Slice-Capacitor
Author :
Changhui, Liu ; Chunmei, Xu ; Le, Liu ; Huahui, He
Author_Institution :
Sch. of Comput. Sci. & Eng., Wuhan Inst. of Technol., Wuhan
fYear :
2008
fDate :
23-25 May 2008
Firstpage :
770
Lastpage :
773
Abstract :
According to wave-absorbing material´s electricity characteristic, this text created a kind of new high-performance, low-cost capacitance type absorbing-wave coat´s thickness measuring system. Carry out a research of thin film measurement which from nm-level to micron-level. According to the theory which capacitor working in electric field, it design a special single-piece capacitance sensor. This system can carry on a measurement to the thickness of thin film from nm-level to micron-level. Pass to adopt a kind of new capacitance signal to collect the framework type integration chip(Frame ASIC) CAV424 and shield measure and low price position RISC microcontroller, it carry out a method combine with the difference technique and three-signals-inspect technique. The system can automatically adjust null, correct and remove a great deal of errors. Because the microcontroller have inside place 10 position A/D conversion and driver of LCD, the CAV424 output´s differential voltage signal can directly with the ADC connection, link in the microcontroller, and the structure of system is very simple.
Keywords :
analogue-digital conversion; microcontrollers; thickness measurement; thin film capacitors; A/D conversion; CAV424; RISC microcontroller; differential voltage signal; electric field; thin film measurement; thin film single slice capacitor; wave absorbing material electricity characteristic; Application specific integrated circuits; Capacitance measurement; Capacitive sensors; Capacitors; Electric variables measurement; Microcontrollers; Semiconductor device measurement; Sensor phenomena and characterization; Thickness measurement; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Processing (ISIP), 2008 International Symposiums on
Conference_Location :
Moscow
Print_ISBN :
978-0-7695-3151-9
Type :
conf
DOI :
10.1109/ISIP.2008.154
Filename :
4554191
Link To Document :
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