• DocumentCode
    1965988
  • Title

    A High Gain 600 GHz Amplifier TMIC Using 35 nm Metamorphic HEMT Technology

  • Author

    Tessmann, A. ; Leuther, A. ; Massler, H. ; Seelmann-Eggebert, M.

  • Author_Institution
    Fraunhofer Inst. for Appl. Solid State Phys. (IAF), Freiburg, Germany
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we are presenting two terahertz monolithic integrated circuits (TMICs) for use in next-generation radar and spectroscopy systems operating in the WR-1.5 waveguide band (500 - 750 GHz). Both amplifier circuits have been realized using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with a benzocyclobutene (BCB) encapsulation to minimize the device parasitics. Furthermore, airbridge type transmission lines (ABTL) and grounded coplanar circuit topology (GCPW) were applied, leading to a compact chip size and excellent gain performance in the submillimeter-wave frequency regime beyond 500 GHz. A realized six-stage ABTL amplifier circuit demonstrated a small-signal gain of more than 20 dB between 502 and 516 GHz, while a six-stage grounded coplanar TMIC achieved a linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz. The total chip size of both submillimeter-wave amplifier circuits was only 0.15 mm2.
  • Keywords
    HEMT integrated circuits; III-V semiconductors; aluminium compounds; amplifiers; gallium arsenide; indium compounds; monolithic integrated circuits; network topology; submillimetre wave integrated circuits; ABTL amplifier circuit; BCB encapsulation; GCPW; InAlAs-InGaAs; WR-1.5 waveguide band; airbridge type transmission lines; bandwidth 557 GHz to 616 GHz; benzocyclobutene encapsulation; compact chip size; device parasitics; frequency 500 GHz to 750 GHz; frequency 600 GHz; gain 20.3 dB; gain performance; grounded coplanar circuit topology; high gain amplifier TMIC; linear gain; mHEMT technology; metamorphic HEMT technology; metamorphic high electron mobility transistor; next-generation radar; six-stage grounded coplanar TMIC; size 35 nm; spectroscopy system; submillimeter-wave amplifier circuit; submillimeter-wave frequency regime; terahertz monolithic integrated circuit; Gain; Gallium arsenide; Indium phosphide; Logic gates; Scattering parameters; mHEMTs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE
  • Conference_Location
    La Jolla, CA
  • ISSN
    1550-8781
  • Print_ISBN
    978-1-4673-0928-8
  • Type

    conf

  • DOI
    10.1109/CSICS.2012.6340102
  • Filename
    6340102