Title :
A CMOS analog front-end chip-set for mega pixel camcorders
Author :
Nakamura, K. ; Decker, S. ; Kelly, D. ; Das, D. ; St.Onge, L. ; Mehr, I. ; Walsh, M. ; Swanson, E. ; Picano, P. ; Mangelsdorf, C. ; Yamaguchi, H. ; Nishio, K. ; Senda, T.
Author_Institution :
High-Speed Converter Group, Analog Devices Inc., Wilmington, MA, USA
Abstract :
In modern CCD video camera systems, packaging and optical requirements constrain the CCD to be mounted close to the camera lens, often on a board separate from the main signal processing. In this configuration, the analog signal from the CCD must be driven across a flexible cable to the main board, where analog pre-processing is performed. In previous camera generations, the challenge was simply to integrate all of the analog functions onto a single CMOS chip compatible with low voltage supplies. This results in low-cost low-power system partitioning now widely used for consumer CCD camera systems. As consumer CCD sensors move toward higher resolution, however, this conventional integration has weaknesses. This paper shows a modified analog front-end integration for high-speed CCD interface to overcome the problems of conventional partitioning.
Keywords :
CCD image sensors; CMOS analogue integrated circuits; analogue processing circuits; video cameras; video signal processing; CCD video camera; CMOS analog front-end chip-set; camcorder; signal processing; CMOS image sensors; Charge coupled devices; Charge-coupled image sensors; High speed optical techniques; Lenses; Optical sensors; Optical signal processing; Packaging; Video equipment; Video signal processing;
Conference_Titel :
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-5853-8
DOI :
10.1109/ISSCC.2000.839744