DocumentCode
1966860
Title
Refrigeration technologies for sub-ambient temperature operation of computing systems
Author
Ghoshal, U. ; Schmidt, R.
Author_Institution
Austin Res. Lab, IBM Res., Austin, TX, USA
fYear
2000
fDate
9-9 Feb. 2000
Firstpage
216
Lastpage
217
Abstract
Thermal management issues are central to development of computing systems in the next millennium. In light of performance and reliability limitations facing scaling of CMOS devices below 100 nm channel lengths at typical operating temperatures (60-100/spl deg/C), many system designers are seriously considering low temperature operation of high performance processors. Two different refrigeration technologies being developed for server applications are described here.
Keywords
CMOS digital integrated circuits; cryogenic electronics; microprocessor chips; network servers; refrigeration; thermal management (packaging); 100 nm; 60 to 100 C; CMOS microprocessor; computing system; refrigeration technology; server; sub-ambient temperature operation; thermal management; CMOS logic circuits; CMOS process; CMOS technology; Cooling; Lead compounds; Refrigeration; Temperature; Thermal conductivity; Thermal management; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
0-7803-5853-8
Type
conf
DOI
10.1109/ISSCC.2000.839755
Filename
839755
Link To Document