DocumentCode :
1966949
Title :
Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling
Author :
Sato, Takao ; Sylvester, Dennis ; Yu Cao ; Chenming Hu
Author_Institution :
California Univ., Berkeley, CA, USA
fYear :
2000
fDate :
9-9 Feb. 2000
Firstpage :
226
Lastpage :
227
Abstract :
In deep submicron processes, inaccuracy of interconnect models can lead to serious design errors. New circuit performance measurement schemes are necessary to verify and calibrate the interconnect models. An accurate in-situ noise and delay measurement technique is developed and a test chip is fabricated to demonstrate its efficacy. The proposed technique can experimentally characterize the noise peak height and the timing skew due to noise. It is intended for generating circuit design guidelines and verifying CAD models and tools.
Keywords :
delays; integrated circuit interconnections; integrated circuit measurement; integrated circuit noise; deep submicron process; in situ measurement; integrated circuit; interconnect coupling; peak noise; signal delay; timing skew; Circuit noise; Circuit optimization; Circuit synthesis; Circuit testing; Delay; Integrated circuit interconnections; Measurement techniques; Noise measurement; Semiconductor device measurement; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
0-7803-5853-8
Type :
conf
DOI :
10.1109/ISSCC.2000.839760
Filename :
839760
Link To Document :
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