DocumentCode
1967010
Title
Compact thermal network model: Realization and reduction
Author
Krishnamoorthy, Shriram ; Chowdhury, Masud H.
fYear
2008
fDate
18-20 May 2008
Firstpage
389
Lastpage
394
Abstract
Thermal design in sub-100 nm technologies imposes significant challenges to the CAD designers. A Compact Thermal Model (CTM) is proposed to represent the package as a network of nodes. The discrete models resulting from, for example, the finite element method (FEM) are usually very large. In order to handle this size of full models, the CTM is condensed using Static Matrix Condensation methodology where the system matrices obtained by the spatial discretization of heat transfer partial differential equation (PDE) are reduced by condensing the heat sources, surface nodes and internal nodes. This method reduces the complexity and at the same time preserves the accuracy of the model.
Keywords
CAD; CMOS integrated circuits; finite element analysis; heat transfer; integrated circuit packaging; matrix algebra; partial differential equations; thermal management (packaging); CAD designer; CMOS technology; CTM; FEM; PDE; compact thermal network model; finite element method; heat transfer partial differential equation; spatial discretization; static matrix condensation methodology; CMOS technology; Electronic packaging thermal management; Finite element methods; Heat transfer; Integrated circuit interconnections; Integrated circuit modeling; Partial differential equations; Power system interconnection; Temperature; Thermal resistance; Thermal Modeling; differential equation; network; nodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/Information Technology, 2008. EIT 2008. IEEE International Conference on
Conference_Location
Ames, IA
Print_ISBN
978-1-4244-2029-2
Electronic_ISBN
978-1-4244-2030-8
Type
conf
DOI
10.1109/EIT.2008.4554334
Filename
4554334
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