DocumentCode :
1967010
Title :
Compact thermal network model: Realization and reduction
Author :
Krishnamoorthy, Shriram ; Chowdhury, Masud H.
fYear :
2008
fDate :
18-20 May 2008
Firstpage :
389
Lastpage :
394
Abstract :
Thermal design in sub-100 nm technologies imposes significant challenges to the CAD designers. A Compact Thermal Model (CTM) is proposed to represent the package as a network of nodes. The discrete models resulting from, for example, the finite element method (FEM) are usually very large. In order to handle this size of full models, the CTM is condensed using Static Matrix Condensation methodology where the system matrices obtained by the spatial discretization of heat transfer partial differential equation (PDE) are reduced by condensing the heat sources, surface nodes and internal nodes. This method reduces the complexity and at the same time preserves the accuracy of the model.
Keywords :
CAD; CMOS integrated circuits; finite element analysis; heat transfer; integrated circuit packaging; matrix algebra; partial differential equations; thermal management (packaging); CAD designer; CMOS technology; CTM; FEM; PDE; compact thermal network model; finite element method; heat transfer partial differential equation; spatial discretization; static matrix condensation methodology; CMOS technology; Electronic packaging thermal management; Finite element methods; Heat transfer; Integrated circuit interconnections; Integrated circuit modeling; Partial differential equations; Power system interconnection; Temperature; Thermal resistance; Thermal Modeling; differential equation; network; nodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro/Information Technology, 2008. EIT 2008. IEEE International Conference on
Conference_Location :
Ames, IA
Print_ISBN :
978-1-4244-2029-2
Electronic_ISBN :
978-1-4244-2030-8
Type :
conf
DOI :
10.1109/EIT.2008.4554334
Filename :
4554334
Link To Document :
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