Title :
New method for verification of analytical device models using transistor parameter fluctuations [MOSFETs]
Author :
Kuhn, C. ; Marksteiner, S. ; Kopley, T.E. ; Weber, W.
Author_Institution :
Inst. of Electron., Univ. der Bundeswehr, Neubiberg, Germany
Abstract :
In this work device parameter fluctuations are considered for verification of analytical device models. We focus on the (WL)/sup -1/2/-dependence of the standard deviation of the threshold voltage /spl sigma//sub Vt/ [1-6]. Besides the known contribution from doping variations, an explicit channel length dependence enhances substantially the (WL)/sup -1/2/-curve. Oxide thickness variation is shown to have minor influence on the V/sub T/-fluctuation and the contribution of mobility fluctuation is completely negligible for a 0.5 /spl mu/m process. It has been found that a percolation model for the current paths through the device can give full account of the experimentally measured values of /spl sigma//sub Vt/.
Keywords :
CMOS digital integrated circuits; MOSFET; SPICE; capacitance; circuit analysis computing; electric resistance; integrated circuit interconnections; integrated circuit modelling; ion implantation; masks; percolation; semiconductor device models; semiconductor doping5802184; 0.5 micron; MOSFETs; analytical device models; current paths; doping variations; explicit channel length dependence; oxide thickness variation; percolation model; threshold voltage; transistor parameter fluctuations; Analytical models; Current measurement; Doping profiles; Fluctuations; Implants; MOSFET circuits; Medical simulation; Semiconductor process modeling; Threshold voltage; Virtual manufacturing;
Conference_Titel :
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-4100-7
DOI :
10.1109/IEDM.1997.650280