DocumentCode
1967050
Title
An application of process synthesis methodology for first-pass fabrication success of high-performance deep-submicron CMOS
Author
Saxena, S. ; Burch, R. ; Vasanth, K. ; Rao, S. ; Fernando, C. ; Davis, J. ; Mozumder, P.K.
Author_Institution
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
fYear
1997
fDate
10-10 Dec. 1997
Firstpage
149
Lastpage
152
Abstract
This paper describes a methodology to reduce the time and cost of developing deep sub-micron semiconductor manufacturing technology. The methodology consists of following the components: compact models for device performance and reliability, compact models for process modules, and synthesis algorithms that allow the rapid exploration of large design spaces to identify all device and process flow designs that meet the device specifications. This approach is illustrated by applying it to the design of CMOS gate shrinks from 0.35 /spl mu/m to 0.29 /spl mu/m drawn poly gate length. The synthesized devices were manufactured, meeting all performance and reliability requirements in the first silicon run.
Keywords
CMOS integrated circuits; ULSI; integrated circuit manufacture; integrated circuit reliability; semiconductor process modelling; 0.29 to 0.35 micron; compact models; deep-submicron CMOS; design spaces; drawn poly gate length; first-pass fabrication; gate shrinks; process flow designs; process modules; process synthesis methodology; reliability requirements; synthesis algorithms; Algorithm design and analysis; Costs; Fabrication; Medical simulation; Process design; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling; Silicon; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-4100-7
Type
conf
DOI
10.1109/IEDM.1997.650283
Filename
650283
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