DocumentCode
1967240
Title
A guide to simulation of hysteretic gate delays based on physical understanding [SOI logic]
Author
Houston, T.W. ; Unnikrishnan, S.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1998
fDate
5-8 Oct. 1998
Firstpage
121
Lastpage
122
Abstract
Studies of floating body effects in SOI transistors and circuits have been widely reported. Nevertheless, in part because of the complexities of the device physics and the inaccuracies of numerical simulations, there is still need for a physical understanding of the floating body effect to guide a circuit designer in evaluation of the resulting hysteretic gate delay. This paper describes the dynamics of the floating-body effect in terms familiar to the circuit designer (voltages, capacitive coupling, and diode currents) and proposes a methodology for specification of body voltages for bounding circuit delay. This methodology is developed for inverters and can be extended to complex gates. A basis for detecting inaccuracies in SPICE simulations is included. Data showing the effect of drain-to-body capacitance on hysteretic behaviour is presented.
Keywords
SPICE; capacitance; circuit CAD; circuit simulation; delays; hysteresis; logic CAD; logic gates; logic simulation; silicon-on-insulator; SOI circuits; SOI logic; SOI transistors; SPICE simulation; SPICE simulation inaccuracies; Si-SiO/sub 2/; body voltage specification methodology; capacitive coupling; circuit delay; circuit design; device physics; diode currents; drain-to-body capacitance effects; floating body effects; floating-body effect dynamics; floating-body voltages; hysteretic behaviour; hysteretic gate delay; hysteretic gate delay simulation; inverters; numerical simulation; simulation; Circuit simulation; Coupling circuits; Delay effects; Diodes; Hysteresis; Inverters; Numerical simulation; Physics; SPICE; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1998. Proceedings., 1998 IEEE International
Conference_Location
Stuart, FL, USA
ISSN
1078-621X
Print_ISBN
0-7803-4500-2
Type
conf
DOI
10.1109/SOI.1998.723141
Filename
723141
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