• DocumentCode
    1967240
  • Title

    A guide to simulation of hysteretic gate delays based on physical understanding [SOI logic]

  • Author

    Houston, T.W. ; Unnikrishnan, S.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1998
  • fDate
    5-8 Oct. 1998
  • Firstpage
    121
  • Lastpage
    122
  • Abstract
    Studies of floating body effects in SOI transistors and circuits have been widely reported. Nevertheless, in part because of the complexities of the device physics and the inaccuracies of numerical simulations, there is still need for a physical understanding of the floating body effect to guide a circuit designer in evaluation of the resulting hysteretic gate delay. This paper describes the dynamics of the floating-body effect in terms familiar to the circuit designer (voltages, capacitive coupling, and diode currents) and proposes a methodology for specification of body voltages for bounding circuit delay. This methodology is developed for inverters and can be extended to complex gates. A basis for detecting inaccuracies in SPICE simulations is included. Data showing the effect of drain-to-body capacitance on hysteretic behaviour is presented.
  • Keywords
    SPICE; capacitance; circuit CAD; circuit simulation; delays; hysteresis; logic CAD; logic gates; logic simulation; silicon-on-insulator; SOI circuits; SOI logic; SOI transistors; SPICE simulation; SPICE simulation inaccuracies; Si-SiO/sub 2/; body voltage specification methodology; capacitive coupling; circuit delay; circuit design; device physics; diode currents; drain-to-body capacitance effects; floating body effects; floating-body effect dynamics; floating-body voltages; hysteretic behaviour; hysteretic gate delay; hysteretic gate delay simulation; inverters; numerical simulation; simulation; Circuit simulation; Coupling circuits; Delay effects; Diodes; Hysteresis; Inverters; Numerical simulation; Physics; SPICE; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1998. Proceedings., 1998 IEEE International
  • Conference_Location
    Stuart, FL, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-4500-2
  • Type

    conf

  • DOI
    10.1109/SOI.1998.723141
  • Filename
    723141