Title :
Hybrid integration of polymers and compound semiconductors in photonics
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
We combine polymers and semiconductors to bring the best of both worlds. We use the well-established semiconductor processing techniques to fabricate structures such as waveguides, gratings, pn junctions, quantum wells. Then we use polymers to bond these samples to transfer substrates. Finally we etch away the growth substrate. With further processing we integrate the semiconductor circuit in the remaining epilayer with polymer waveguides. The end product is a photonic chip, containing semiconductor only in the regions where there is an optical wave hence where the properties of the semiconductor are needed. The rest is made out of low loss and cost polymers containing low loss optical guides, which are almost identical to optical fiber. This technology is applied to high speed traveling wave modulators and tunable grating reflectors
Keywords :
diffraction gratings; electro-optical modulation; integrated optics; integrated optoelectronics; optical fabrication; optical planar waveguides; optical polymers; optical waveguide filters; semiconductor quantum wells; semiconductor technology; compound semiconductors; epilayer; etch; gratings; growth substrate; high speed traveling wave modulators; hybrid integration; low cost polymers; low loss optical guides; low loss polymers; optical wave; photonic chip; photonics; pn junctions; polymer waveguides; polymers; quantum wells; semiconductor circuit; semiconductor processing techniques; transfer substrates; tunable grating reflectors; waveguides; Bonding; Gratings; High speed optical techniques; Optical fiber losses; Optical modulation; Optical polymers; Optical waveguides; Semiconductor waveguides; Substrates; Waveguide junctions;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.969071