Title :
Chip-package co-design of a 5 GHz RF front-end for WLAN
Author :
Wambacq, P. ; Donnay, S. ; Pieters, P. ; Diels, W. ; Vaesen, K. ; De Raedt, W. ; Beyne, E. ; Engels, M. ; Bolsens, I.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Single-package integration of complete transceivers based on a thin-film MCM technology (MCM-D) with integrated passives is demonstrated with a 6.7/spl times/6.5 mm/sup 2/ single-package front-end. This front-end includes the RF blocks and two RF bandpass filters of a 5 GHz WLAN receiver.
Keywords :
integrated circuit packaging; multichip modules; transceivers; wireless LAN; 5 GHz; MCM-D technology; RF front-end; WLAN receiver; chip-package co-design; transceiver; Band pass filters; CMOS technology; Capacitors; Conducting materials; Dielectric substrates; Inductors; Radio frequency; Transceivers; Voltage-controlled oscillators; Wireless LAN;
Conference_Titel :
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-5853-8
DOI :
10.1109/ISSCC.2000.839797
