DocumentCode
1967791
Title
Electronic packaging for 10-100 Gb/s OE systems
Author
Fokken, Gregg ; Daniel, Erik ; Degerstrom, Mike ; Schaefer, Timothy ; Zabinski, Pat ; Gilbert, Barry
Volume
2
fYear
2001
fDate
2001
Firstpage
861
Abstract
The minimization of discontinuities in controlled-impedance signal interconnect will be discussed, including novel ideas for extending present packaging fabrication and assembly technology to higher frequency operation
Keywords
chip scale packaging; integrated optoelectronics; lead bonding; 10 to 100 Gbit/s; assembly; chip-to-chip interconnects; controlled-impedance signal interconnect; discontinuities minimization; higher frequency operation; optical interconnects; packaging fabrication; wire bonding technology; Bonding; CMOS technology; Clocks; Electronics packaging; Integrated circuit interconnections; Power system interconnection; Radio frequency; Semiconductor device measurement; Silicon on insulator technology; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location
San Diego, CA
ISSN
1092-8081
Print_ISBN
0-7803-7105-4
Type
conf
DOI
10.1109/LEOS.2001.969088
Filename
969088
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