Title :
Electronic packaging for 10-100 Gb/s OE systems
Author :
Fokken, Gregg ; Daniel, Erik ; Degerstrom, Mike ; Schaefer, Timothy ; Zabinski, Pat ; Gilbert, Barry
Abstract :
The minimization of discontinuities in controlled-impedance signal interconnect will be discussed, including novel ideas for extending present packaging fabrication and assembly technology to higher frequency operation
Keywords :
chip scale packaging; integrated optoelectronics; lead bonding; 10 to 100 Gbit/s; assembly; chip-to-chip interconnects; controlled-impedance signal interconnect; discontinuities minimization; higher frequency operation; optical interconnects; packaging fabrication; wire bonding technology; Bonding; CMOS technology; Clocks; Electronics packaging; Integrated circuit interconnections; Power system interconnection; Radio frequency; Semiconductor device measurement; Silicon on insulator technology; Wire;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.969088
