• DocumentCode
    1968233
  • Title

    The Influence of Pressure on SF6 Arc with Contact Evaporation

  • Author

    Liau, Vui Kien ; Lee, Byeong Yoon ; Song, Ki Dong ; Park, Kyung Yup

  • Author_Institution
    Adv. Power Apparatus Group, Korean Electrotechnology Res. Inst., Kyungnam
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    496
  • Lastpage
    496
  • Abstract
    Computer simulation has been performed to investigate the effects of pressure on contact evaporation process of SF6 arc in Laval Nozzle. Computations have been performed by a commercial computational fluids dynamics package (PHOENICS)
  • Keywords
    SF6 insulation; arcs (electric); computational fluid dynamics; evaporation; nozzles; Laval Nozzle; SF6 arc; commercial computational fluids dynamics package; computer simulation; contact evaporation process; Circuit breakers; Computational fluid dynamics; Computer simulation; Copper; Electrodes; Navier-Stokes equations; Packaging; Plasma temperature; Sulfur hexafluoride; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Field Computation, 2006 12th Biennial IEEE Conference on
  • Conference_Location
    Miami, FL
  • Print_ISBN
    1-4244-0320-0
  • Type

    conf

  • DOI
    10.1109/CEFC-06.2006.1633286
  • Filename
    1633286
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1968233