DocumentCode
1968439
Title
Electrical Performance of Electronic Packaging [frontmatter]
fYear
1997
fDate
27-29 Oct. 1997
Abstract
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
Keywords
packaging; accelerated modeling; characterization techniques; coupling; crosstalk simulation; electrical performance; electronic packaging; microwave packaging; model verification; on-chip interconnect parameter extraction; on-chip noise analysis; power distribution design; radiated emission; simulation; simultaneous switching noise modeling; system design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634022
Filename
634022
Link To Document