• DocumentCode
    1968643
  • Title

    The electrical challenges of packaging the IBM AS/400

  • Author

    Bartley, Gerald K. ; Dahlen, Paul E.

  • Author_Institution
    Electr. Packaging Eng., IBM Corp., Rochester, MN, USA
  • fYear
    1997
  • fDate
    27-29 Oct. 1997
  • Firstpage
    3
  • Lastpage
    4
  • Abstract
    The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.
  • Keywords
    IBM computers; computer architecture; packaging; IBM AS/400; bus width; computer system design; electrical characteristics; material cost; packaging; physical architecture; technology; Bandwidth; Clocks; Computer architecture; Dielectric losses; Frequency; Packaging; Power systems; Switches; System buses; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/EPEP.1997.634023
  • Filename
    634023
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1968643