• DocumentCode
    1968665
  • Title

    600 V single-chip power conversion system based on thin layer silicon-on-insulator

  • Author

    Letavic, T. ; Arnold, E. ; Simpson, M. ; Peters, E. ; Aquino, R. ; Egloff, R. ; Wong, Simon ; Mukherjee, S.

  • Author_Institution
    Res. Lab., Philips Electron.North America Corp., Briarcliff Manor, NY, USA
  • fYear
    1998
  • fDate
    5-8 Oct. 1998
  • Firstpage
    133
  • Lastpage
    134
  • Abstract
    Summary form only given. An integrated 600 V power conversion circuit is described based on smart power technology which combines novel lateral high-voltage RESURF transistor structures and a merged bipolar/CMOS/DMOS process flow on thin-layer SOI substrates. A modular process flow provides for the integration of half-bridge power stages along with level shifting and lowand medium-voltage control. This opens new application areas for thin-layer SOI, such as lighting electronics, power modules, motor control, etc., and is a significant development for the integration of power conversion systems.
  • Keywords
    BIMOS integrated circuits; integrated circuit design; power convertors; power integrated circuits; silicon-on-insulator; 600 V; Si-SiO/sub 2/; half-bridge power stage integration; integrated power conversion circuit; lateral high-voltage RESURF transistor structures; level shifting control; lighting electronics; low-voltage control; medium-voltage control; merged bipolar/CMOS/DMOS process flow; modular process flow; motor control; power conversion system integration; power modules; single-chip power conversion system; smart power technology; thin layer SOI application areas; thin layer silicon-on-insulator; thin-layer SOI substrates; CMOS logic circuits; CMOS technology; Circuit topology; Fabrication; Logic devices; Medium voltage; Power conversion; Power integrated circuits; Silicon on insulator technology; Surface waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1998. Proceedings., 1998 IEEE International
  • Conference_Location
    Stuart, FL, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-4500-2
  • Type

    conf

  • DOI
    10.1109/SOI.1998.723147
  • Filename
    723147