• DocumentCode
    1968797
  • Title

    Notice of Retraction
    High Temperature Failure Mechanism of Multi-layer Ceramic Capacitor

  • Author

    Bo Li ; Ya Zhang ; Hongxiang Zhang

  • Author_Institution
    Mech. & Electron. Eng. Inst., North Univ. of China, Taiyuan, China
  • fYear
    2010
  • fDate
    30-31 Jan. 2010
  • Firstpage
    62
  • Lastpage
    64
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    Lacking of knowing the performance parameters of electrical products can lead to misunderstand the stability of the system. And Multi-layer ceramic condenser (MLCC) as a main class of chip electronic component and a new kind of component, its properties is closely related to the dielectric materials. Then the characteristics of MLCC is introduced in this paper, and the stability of MLCC on temperature is also discussed, discussed the reason of the capacity change by a wide margin under the high-temperature condition, and given some suggestion on the applying methods of MLCC.
  • Keywords
    ceramic capacitors; failure analysis; capacity change; chip electronic component; dielectric materials; high-temperature condition; high-temperature failure mechanism; multilayer ceramic capacitor; Capacitance; Capacitors; Ceramics; Dielectrics; Electrical products; Electrodes; Electrons; Failure analysis; Ocean temperature; Stability; high temperature experiment; high temperature failure; multi-layer ceramic capacitor; temperature characteristics research;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovative Computing & Communication, 2010 Intl Conf on and Information Technology & Ocean Engineering, 2010 Asia-Pacific Conf on (CICC-ITOE)
  • Conference_Location
    Macao
  • Print_ISBN
    978-1-4244-5634-5
  • Type

    conf

  • DOI
    10.1109/CICC-ITOE.2010.23
  • Filename
    5439292