Title :
EMI and power delivery design in PC systems
Author :
Herrell, Dennis ; Beker, Benjamin
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
Abstract :
This paper addresses the relationship of power transient design with the EMI characteristics of high-performance microprocessors. After a brief review of EMI and its role in modern PC systems, a modeling approach for a complete CPGA package is discussed. The model includes on-chip and on-package decoupling capacitors, multiple power and ground planes for core voltages, C4 bumps, inter-planar vias, and pins. Equivalent SPICE circuit for the chip-package combination is obtained and the results for power transients and frequency domain transfer characteristics are given.
Keywords :
SPICE; computer power supplies; electromagnetic interference; equivalent circuits; microcomputers; packaging; C4 bumps; CPGA package; EMI; PC system; SPICE model; chip-package combination; decoupling capacitors; equivalent circuit; frequency domain transfer characteristics; ground planes; high-performance microprocessor; inter-planar vias; multiple power planes; pins; power delivery design; power transients; Circuits; Electromagnetic interference; Frequency domain analysis; Microprocessors; Packaging; Pins; Power capacitors; Power system modeling; SPICE; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634029
