EMI and power delivery design in PC systems

Author

Herrell, Dennis ; Beker, Benjamin

Author_Institution

Adv. Micro Devices Inc., Austin, TX, USA

fYear

1997

fDate

27-29 Oct. 1997

Firstpage

23

Lastpage

26

Abstract

This paper addresses the relationship of power transient design with the EMI characteristics of high-performance microprocessors. After a brief review of EMI and its role in modern PC systems, a modeling approach for a complete CPGA package is discussed. The model includes on-chip and on-package decoupling capacitors, multiple power and ground planes for core voltages, C4 bumps, inter-planar vias, and pins. Equivalent SPICE circuit for the chip-package combination is obtained and the results for power transients and frequency domain transfer characteristics are given.

Keywords

SPICE; computer power supplies; electromagnetic interference; equivalent circuits; microcomputers; packaging; C4 bumps; CPGA package; EMI; PC system; SPICE model; chip-package combination; decoupling capacitors; equivalent circuit; frequency domain transfer characteristics; ground planes; high-performance microprocessor; inter-planar vias; multiple power planes; pins; power delivery design; power transients; Circuits; Electromagnetic interference; Frequency domain analysis; Microprocessors; Packaging; Pins; Power capacitors; Power system modeling; SPICE; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Conference_Location

Austin, TX

Print_ISBN

0-7803-8649-3

Type

conf

DOI

10.1109/EPEP.1997.634029

Filename

634029