Title :
Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations
Author :
Koike, Shinji ; Kaizu, Katsumi
Author_Institution :
NTT Network Service Syst. Labs., Musashino, Japan
Abstract :
A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.
Keywords :
circuit noise; large scale integration; packaging; printed circuit design; surface mount technology; 622.08 Mbit/s; FR4 substrate material; low-cost technique; simultaneous switching noise; sub-board area; sub-board packaging configurations; switching gates; thin insulator film; Conductive films; Connectors; Frequency; Insulation; Large scale integration; Noise reduction; Packaging; Power supplies; Substrates; Telecommunication switching;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634033
