• DocumentCode
    1969326
  • Title

    Design and implementation of MEMS based microneedles for biomedical applications

  • Author

    Priyanka Aggarwal ; Kaler, K.V.I.S. ; Badawy, Wael

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Calgary Univ., Alta., Canada
  • Volume
    3
  • fYear
    2003
  • fDate
    4-7 May 2003
  • Firstpage
    1505
  • Abstract
    This paper addresses the practical design and implementation MEMS (microelectro-mechanical system) based in-plane silicon microneedles for transdermal drug delivery and/or blood sampling for biomedical and biotechnology applications. The characteristics of in-plane microneedles are far more reliable than out-of-plane microneedles for transdermal drug delivery and blood sampling. In order to obtain the sample of blood from the subcutaneous fat layer, which occurs at a distance of 2000 to 4000 μm below the skin surface, the length of our MEMS based in-plane microneedle have been set at 3000 μm. This microneedle length is impractical for out-of-plane microneedles. Drug delivery and blood samplings place requirement in terms of minimal needle dimensions and force withstanding capabilities, which are inversely related to each other. The strength of the microneedles has been examined analytically and modeled using finite element modeling tools. Through performance analysis it is shown that the proposed design is a significant improvement over existing microneedles.
  • Keywords
    blood; drug delivery systems; micromachining; micromechanical devices; MEMS; biomedical application; biotechnology application; blood sampling; finite element modeling tool; in-plane silicon microneedle; microelectro-mechanical system; microneedle length; microneedle strength; needle dimension; skin force; skin surface; transdermal drug delivery; Biotechnology; Blood; Drug delivery; Finite element methods; Micromechanical devices; Needles; Performance analysis; Sampling methods; Silicon; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2003. IEEE CCECE 2003. Canadian Conference on
  • ISSN
    0840-7789
  • Print_ISBN
    0-7803-7781-8
  • Type

    conf

  • DOI
    10.1109/CCECE.2003.1226190
  • Filename
    1226190