Title :
High frequency characterization of interconnection on glass fiber inforced PCB (G30)
Author :
Owzar, A. ; Weickhmann, C.M. ; Fazelpour, F. ; Windirsch, P. ; Reimers, J. ; Reichl, H.
Author_Institution :
Deutsche Telekom AG, Darmstadt, Germany
Abstract :
One of the main limitations for the application of the MCM approach is the factor of costs. This problem can be solved by using low cost PCB substrate material. It must be assured, that PCB materials can meet the demands on the interconnection parameter for MCM wiring systems. It is shown by measurement results, that the line impedance is in the required range for MCM application. However, the increase in wiring integration can be a handicap regarding the coupling factor.
Keywords :
S-parameters; electric impedance; fibre reinforced composites; high-frequency transmission line measurement; integrated circuit interconnections; multichip modules; printed circuits; G30; HF characterization; MCM wiring systems; coupling factor; glass fiber inforced PCB; interconnection; line impedance; low cost PCB substrate material; Costs; Frequency; Glass; Impedance; Multichip modules; Scattering parameters; Substrates; Testing; Transmission line measurements; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634042
