Title :
The enhancement of static simulator package characterization through conductor segmentation
Author :
Klemens, Guy ; Aparin, Vladimir ; Gard, Kevin
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
Abstract :
A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.
Keywords :
S-parameters; capacitance; electronic engineering computing; integrated circuit packaging; simulation; conductor segmentation; package models; static simulator package characterization; Bonding; Capacitance; Circuit simulation; Conductors; Coupling circuits; Electronics packaging; Inductance; Integrated circuit packaging; Resonance; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634043
