DocumentCode
1970216
Title
Numerical modeling of inductance for a distributed system
Author
Gravrok, Roger ; Byers, Andrew ; Piket-May, Melinda
Author_Institution
Sequent Comput. Syst., Eau Claire, MI, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
83
Lastpage
86
Abstract
This paper presents a novel method for calculating the lumped inductance of a 3D distributed system. The inductance of a complex power distribution structure is extracted using a system level approach. The method is validated against theoretical solutions.
Keywords
finite difference time-domain analysis; inductance; packaging; 3D distributed system; FDTD simulation; complex power distribution structure; lumped inductance; numerical modeling; package design; system level approach; Design engineering; Distributed computing; Equations; Inductance; Numerical models; Packaging; Power distribution; Power engineering and energy; Pulse measurements; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634044
Filename
634044
Link To Document