Title :
Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages
Author :
Yun, Sang-Ki ; Lee, Hai-Young
Author_Institution :
Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon, South Korea
Abstract :
Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is inappropriate for the high-speed package design. Plastic packaging materials significantly increase bondwire crosstalk due to the mutual electromagnetic coupling enhanced by the dielectric and radiation effects.
Keywords :
MMIC; SPICE; crosstalk; digital integrated circuits; fast Fourier transforms; integrated circuit packaging; lead bonding; method of moments; plastic packaging; time-domain analysis; FFT algorithm; coupled bondwires; dielectric effects; electromagnetic coupling; full-wave method of moments; high-speed package design; high-speed plastic packages; mutual EM coupling; packaging materials; picosecond pulses; radiation effects; wideband crosstalk analysis; Algorithm design and analysis; Bonding; Crosstalk; Dielectric materials; Electromagnetic coupling; Moment methods; Plastic packaging; Radiation effects; SPICE; Wideband;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634046
