DocumentCode :
1970644
Title :
Evanescent-mode analysis of short-channel effects in fully depleted SOI and related MOSFETs
Author :
Monroe, D. ; Hergenrother, J.M.
Author_Institution :
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
fYear :
1998
fDate :
5-8 Oct. 1998
Firstpage :
157
Lastpage :
158
Abstract :
Fully depleted SOI (FDSOI) and double-gate (DG) structures offer significant improvement in long-channel subthreshold swing over bulk devices, which are heavily doped to reduce short-channel effects (SCEs) such as threshold voltage (V/sub T/) roll-off and drain-induced barrier lowering (DIBL). Using idealized devices, we argue that previous SCE analyses fail to solve the electrostatics problem, and scale incorrectly with device dimensions. Although FDSOI devices can be as much as three (=/spl epsiv//sub Si///spl epsiv//sub oxide/) times shorter than bulk devices with identical SCE, our analysis indicates that this requires both buried oxide and silicon thicknesses to be 30-60% of the effective gate length L/sub eff/, a daunting prospect for L/sub eff/<100 nm.
Keywords :
MOSFET; buried layers; nanotechnology; semiconductor device models; silicon-on-insulator; 100 nm; FDSOI device length; FDSOI structures; SCE analysis; SCE analysis scaling; Si-SiO/sub 2/; bulk devices; buried oxide thickness; device dimensions; double-gate structures; drain-induced barrier lowering; effective gate length; electrostatics; evanescent-mode analysis; fully depleted SOI MOSFETs; fully depleted SOI structures; long-channel subthreshold swing; short-channel effects; silicon thickness; threshold voltage roll-off; Analytical models; Artificial intelligence; Capacitance; Electrons; Failure analysis; Laplace equations; MOSFETs; Manufacturing; Substrates; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1998. Proceedings., 1998 IEEE International
Conference_Location :
Stuart, FL, USA
ISSN :
1078-621X
Print_ISBN :
0-7803-4500-2
Type :
conf
DOI :
10.1109/SOI.1998.723159
Filename :
723159
Link To Document :
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