Title :
A new flip-chip mounting technique for high temperature operation
Author :
Basu, Ananjan ; Itoh, Tatsuo
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation encountered in conventional bonding techniques such as soldering. This method uses electro-deposited copper to form the contacts, and temperature limitation comes only from the device itself.
Keywords :
assembling; copper; flip-chip devices; microwave circuits; printed circuit manufacture; Cu; bonding technique; circuit board; electro-deposited Cu contacts; flip-chip mounting technique; high temperature operation; microwave semiconductor devices; Bonding; Coatings; Contacts; Copper; Microwave devices; Printed circuits; Protection; Resists; Semiconductor devices; Temperature;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634047
