Title :
Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation
Author :
Cervenka, Johann ; Fleischmann, Peter ; Selberherr, Siegfried ; Knaipp, Martin ; Unterleitner, Franz
Author_Institution :
Technical University Vienna, Austria
fDate :
11-13 September 2001
Keywords :
Breakdown voltage; Doping; Fingers; Ion implantation; MOSFETs; Microelectronics; Process design; Space charge; Surface resistance; Switches;
Conference_Titel :
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN :
2-914601-01-8
DOI :
10.1109/ESSDERC.2001.195242
