Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Electrothermal transient analysis of multi-layer high-density interconnects are carried out using hybrid nonlinear time- domain finite element method (FEM), and the input signal is supposed to be a fast electrostatic discharge (ESD) pulse. The preconditioned conjugated gradient technique (PCG) is combined with the element-by-element FEM so as to enhance our numerical analysis, and the nonlinearities of temperature-dependent electrical and thermal conductivities of substrate materials are treated appropriately. Parasitic studies are performed to show time-dependent temperature distributions of some typical interconnects which can be fabricated by advanced semiconductor technologies, such as 90 nm CMOS, etc.