Title :
Characterization, modeling and optimization of high power module packaging
Author :
Trivedi, Malay ; Shenai, Krishna
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Abstract :
This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.
Keywords :
failure analysis; insulated gate bipolar transistors; modelling; modules; optimisation; packaging; power electronics; semiconductor device reliability; 2D numerical simulations; IGBTs; characterization; clamped inductive switching stress; electrical performance; high power module packaging; modeling; nonisothermal simulations; optimization; short-circuit stress; Circuit simulation; Current density; Insulated gate bipolar transistors; Multichip modules; Numerical simulation; Packaging; Power electronics; Semiconductor devices; Switching circuits; Temperature;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634049
