Wireless Interconnect by Slotted Ground Plane

This paper proposes a novel method for wireless interconnect in three-dimensional (3D) multiple packaging of large scale integrated circuits (LSI). This interconnect consists of micro-strip-line (MSL) on a silicon substrate and slot on a ground plane. A coupling by stacked slots provides the wireless interconnect. The proposed method provides a use of large sized ground plane which reduces the interference from other wireless system and the effect by noise. The simulation and experiment demonstrate the novel wireless interconnect.