• DocumentCode
    1971428
  • Title

    A simultaneous switching noise analysis of a high speed memory module including the test environments and system-level models

  • Author

    Choi, Joon-Ho ; Kim, Kyung-Hwa ; Lee, Jung-Bae ; Kim, Taek-Soo ; Kong, Jeong-Taek ; Lee, Sang-Hoon

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyungki, South Korea
  • fYear
    1997
  • fDate
    27-29 Oct. 1997
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    As memory module products become more byte-wide and operate at higher speeds, more of the simultaneous switching noise (SSN) is observed. This paper presents SSN analysis results of high speed memory modules considering the power/ground planes and various interconnects of a test environment and computer system. Using the proposed model, highly accurate simulation results are obtained. Furthermore, we analyze the effect of SSN on the clock jitter and RAS Vil margin. The same model is also used to observe the effect of the decoupling capacitors on SSN. Based on our analysis, memory modules can be redesigned to increase the reliability.
  • Keywords
    circuit noise; circuit testing; equivalent circuits; jitter; modules; packaging; semiconductor storage; switching; clock jitter; decoupling capacitors; ground planes; high speed memory module; interconnects; power planes; reliability; simultaneous switching noise analysis; system-level models; test environments; Capacitors; Circuit testing; Integrated circuit interconnections; Integrated circuit noise; Power system interconnection; Power system modeling; RLC circuits; Semiconductor device noise; System testing; Working environment noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/EPEP.1997.634050
  • Filename
    634050