DocumentCode :
1971428
Title :
A simultaneous switching noise analysis of a high speed memory module including the test environments and system-level models
Author :
Choi, Joon-Ho ; Kim, Kyung-Hwa ; Lee, Jung-Bae ; Kim, Taek-Soo ; Kong, Jeong-Taek ; Lee, Sang-Hoon
Author_Institution :
Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyungki, South Korea
fYear :
1997
fDate :
27-29 Oct. 1997
Firstpage :
109
Lastpage :
112
Abstract :
As memory module products become more byte-wide and operate at higher speeds, more of the simultaneous switching noise (SSN) is observed. This paper presents SSN analysis results of high speed memory modules considering the power/ground planes and various interconnects of a test environment and computer system. Using the proposed model, highly accurate simulation results are obtained. Furthermore, we analyze the effect of SSN on the clock jitter and RAS Vil margin. The same model is also used to observe the effect of the decoupling capacitors on SSN. Based on our analysis, memory modules can be redesigned to increase the reliability.
Keywords :
circuit noise; circuit testing; equivalent circuits; jitter; modules; packaging; semiconductor storage; switching; clock jitter; decoupling capacitors; ground planes; high speed memory module; interconnects; power planes; reliability; simultaneous switching noise analysis; system-level models; test environments; Capacitors; Circuit testing; Integrated circuit interconnections; Integrated circuit noise; Power system interconnection; Power system modeling; RLC circuits; Semiconductor device noise; System testing; Working environment noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
Type :
conf
DOI :
10.1109/EPEP.1997.634050
Filename :
634050
Link To Document :
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