• DocumentCode
    1971636
  • Title

    Analysis of the stress-optical effects in silica-on-silicon optical waveguides

  • Author

    Lang, Tingting ; Kuang, Jingguo ; Lin, Xufeng

  • Author_Institution
    Coll. of Opt. & Electron. Technol., China Jiliang Univ., Hangzhou, China
  • fYear
    2010
  • fDate
    8-12 Dec. 2010
  • Firstpage
    224
  • Lastpage
    225
  • Abstract
    Stress-induced birefringence in silica-on-silicon waveguides is analyzed by the finite element method using the normalized plane strain model. The simulation results show that the thermal expansion coefficient of the upper-cladding is the most critical factor. A waveguide with zero birefringence is obtained and used to realize polarization independent AWGs.
  • Keywords
    birefringence; elemental semiconductors; finite element analysis; optical waveguides; piezo-optical effects; silicon; silicon compounds; thermal expansion; SiO2-Si; finite element method; normalized plane strain model; optical waveguides; polarization independent AWG; stress optical effects; stress-induced birefringence; thermal expansion coefficient; upper cladding; Optical device fabrication; Optical fibers; Optical polarization; Strain; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Photonics Conference and Exhibition (ACP), 2010 Asia
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-7111-9
  • Type

    conf

  • DOI
    10.1109/ACP.2010.5682752
  • Filename
    5682752
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1971636