Title : 
Generation of the electrothermal Cauer RC model using a recursive method
         
        
            Author : 
Koh, Jeongwook ; Noebauer, Gerhard ; An, Chul
         
        
            Author_Institution : 
TU M¨unchen, Munich, Germany and Infineon Technologies AG, Munich, Germany
         
        
        
            fDate : 
11-13 September 2001
         
        
        
        
            Keywords : 
Circuit simulation; Coupling circuits; Electronic packaging thermal management; Electrothermal effects; Impedance; Mathematical model; Resistors; Temperature dependence; Topology; Transfer functions;
         
        
        
        
            Conference_Titel : 
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
         
        
            Print_ISBN : 
2-914601-01-8
         
        
        
            DOI : 
10.1109/ESSDERC.2001.195309