Title :
Modelling the Current Density and Resistance of Interconnect Vias
Author :
Reeves, G.K. ; Holland, A.S. ; Leech, P.W.
Author_Institution :
RMIT, Melbourne, Australia
fDate :
11-13 September 2001
Keywords :
Australia; Conductivity; Copper; Current density; Electric resistance; Finite element methods; Integrated circuit interconnections; Plugs; Ultra large scale integration; Wiring;
Conference_Titel :
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN :
2-914601-01-8
DOI :
10.1109/ESSDERC.2001.195311
