Title :
(Invited) Modeling reliability in GaN HEMTs
Author_Institution :
Sch. of Electr., Comput. & Energy Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
In this paper we present modeling reliability concerns in GaN HEMT technology. A theoretical model was developed to model the piezoelectric polarization charge dependence on the applied gate voltage. To model self-heating effects, an elec-tro-thermal device simulator was developed that couples the Monte Carlo-Poisson solver with the energy balance solver for the acoustic and optical phonons. Current collapse was explained as charging the surface states due the Paul-Frenkel tunneling from the gate into the gate to drain extension. Excellent agreement is obtained between the theoretical calculations and the experimental data of the unstressed and the stressed devices with this model.
Keywords :
III-V semiconductors; Monte Carlo methods; Poisson equation; dielectric polarisation; gallium compounds; high electron mobility transistors; phonons; piezoelectricity; semiconductor device models; semiconductor device reliability; surface states; wide band gap semiconductors; GaN; GaN HEMT technology; Monte Carlo-Poisson solver; Paul-Frenkel tunneling; acoustic phonons; electro-thermal device simulator; energy balance solver; optical phonons; piezoelectric polarization charge dependence; reliability modeling; self-heating effects; stressed devices; surface states; unstressed devices; Acoustics; Electron optics; Gallium nitride; HEMTs; Logic gates; MODFETs; Phonons; GaN HEMTs; current collapse; inverse piezoelectric effect; reliability modeling; self-heating;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4799-0350-4
DOI :
10.1109/IIRW.2013.6804150